AI Boom Drives Surge in Chip Packaging Investments
The growing demand for processors for artificial intelligence has made advanced chip packaging one of the key segments of the semiconductor industry, Reuters reports.
The technology allows combining computing components and memory in a single package, accelerating data exchange.
According to a Yole Group forecast, in 2026, revenue from advanced packaging will for the first time exceed that from traditional packaging, with capital investments in it approaching $28 billion. Taiwan's TSMC remains the leader, but its capacities are insufficient to meet growing demand.
According to a Reuters source, Nvidia is funding the expansion of production at ASE Technology's subsidiary. Taiwan's Powertech, together with Broadcom, plans to invest $400 million in a facility in Singapore. Production may begin in 2028.
